期刊


ISSN1537-0755
刊名Electronic Device Failure Analysis
参考译名电子设备故障分析
收藏年代2004～2024



全部

2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2014 2015
2016 2017 2018 2019 2020 2021
2022 2023 2024

2024, vol.26, no.1 2024, vol.26, no.2 2024, vol.26, no.3 2024, vol.26, no.4

题名作者出版年年卷期
GUEST EDITORIALNicholas Antoniou20242024, vol.26, no.4
FOUR-DIMENSIONAL SCANNING TRANSMISSION ELECTRON MICROSCOPY: PART III, PTYCHOGRAPHYAaron C. Johnston-Peck; Andrew A. Herzing20242024, vol.26, no.4
NONDESTRUCTIVE 3D X-RAY MICROSCOPY SPEEDS THROUGHPUT IN NEW FAILURE ANALYSIS WORKFLOWSCheryl Hartfield20242024, vol.26, no.4
NOTEWORTHY NEWS (1)anonymous20242024, vol.26, no.4
PRECISE FINAL SPECIMEN THINNING BY CONCENTRATED ARGON ION BEAM MILLING OF PLAN VIEW TEM SPECIMENS PREPARED IN THE XENON PLASMA FIBC. S. Bonifacio; Y. Yu; M. L. Ray; M. Skowronski; P. E. Fischione20242024, vol.26, no.4
ELECTRONICALLY VIABLETEM SAMPLES WITH PFIB AND STEM EBICWilliam A. Hubbard20242024, vol.26, no.4
EDFAS AWARDSMary Anne Jerson20242024, vol.26, no.4
NOTEWORTHY NEWS (2)anonymous20242024, vol.26, no.4
EDFAS MEMBERS RECEIVE ASM AWARDSanonymous20242024, vol.26, no.4
NOTEWORTHY NEWS (3)anonymous20242024, vol.26, no.4
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