期刊


ISSN1537-0755
刊名Electronic Device Failure Analysis
参考译名电子设备故障分析
收藏年代2004～2024



全部

2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2014 2015
2016 2017 2018 2019 2020 2021
2022 2023 2024

2023, vol.25, no.1 2023, vol.25, no.2 2023, vol.25, no.3 2023, vol.25, no.4

题名作者出版年年卷期
SiC POWER DEVICES AND RELATED ROBUSTNESS AND RELIABILITY ASPECTSPeter Friedrichs20232023, vol.25, no.3
ADVANCEMENTS IN IMAGE PATTERN RECOGNITION FOR LOCK-IN THERMOGRAPHY HOTSPOT DETECTION AND CLASSIFICATION WITH SUPERVISED LEARNINGKyu Kyu Thinn; Rui Zhen Tan; Teh Tict Eng; Ming Xue20232023, vol.25, no.3
FOUR-DIMENSIONAL SCANNING TRANSMISSION ELECTRON MICROSCOPY: PART I: IMAGING, STRAIN MAPPING, AND DEFECT DETECTIONAaron C. Johnston-Peck; Andrew A. Herzing20232023, vol.25, no.3
FAILURE ANALYSIS OF PHOTONIC INTEGRATED CIRCUITSFrieder H. Baumann; Brian Popielarski; Ryan Sweeney; Felix Beaudoin; Ken Giewont20232023, vol.25, no.3
MULTILAYER PERCEPTRON DEVELOPMENT TO IDENTIFY PLASTICS USING FLUORESCENCE LIFETIME IMAGING MICROSCOPYGeorgekutty Jose Maniyattu; Eldho Geegy; Maximilian Wohlschlager; Nina Leiter; Martin Versen; and Christian Laforsch20232023, vol.25, no.3
OISTFA/2023 PREVIEWFrank Altmann20232023, vol.25, no.3
SPOTLIGHT ON TUTORIALSNavid Asadi; Bhanu P. Sood20232023, vol.25, no.3
IN MEMORIAMNicholas Antoniou20232023, vol.25, no.3
DIRECTORY OF INDEPENDENT FA PROVIDERSRosalinda M. Ring20232023, vol.25, no.3
LITERATURE REVIEW: Peer-Reviewed Literature of Interest to Failure Analysis: Beam-based Analysis TechniquesMichael R. Bruce20232023, vol.25, no.3
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