期刊


ISSN1537-0755
刊名Electronic Device Failure Analysis
参考译名电子设备故障分析
收藏年代2004～2024



全部

2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2014 2015
2016 2017 2018 2019 2020 2021
2022 2023 2024

2020, vol.22, no.1 2020, vol.22, no.2 2020, vol.22, no.3

题名作者出版年年卷期
ELECTRONIC DEVICE FA IN THE TIME OF COVID-19 AND SOCIAL UNRESTNicholas Antoniou20202020, vol.22, no.3
PRODUCT NEWSTed Kolasa20202020, vol.22, no.3
ISTFA 2020 PREVIEWDavid Grosjean20202020, vol.22, no.3
IMPROVED SIGNAL DETECTION SENSITIVITY FOR HIGH RESOLUTION IMAGING IN SCANNING ACOUSTIC TOMOGRAPHYHiroki Mitsuta; Taiichi Takezaki; Kaoru Sakai; Kenta Sumikawa; Masakatsu Murai; Kotaro Kikukawa20202020, vol.22, no.3
DEFECT CHARACTERIZATION OF ADVANCED PACKAGES USING NOVEL PHASE AND DARK FIELD X-RAY IMAGINGS. H. Lau; Sheraz Gul; Guibin Zan; David Vine; Sylvia Lewis; Wenbing Yun20202020, vol.22, no.3
FAILURE ANALYSIS, STATISTICAL RISK ASSESSMENT, AND ADVANCED MODELING IN A STRUCTURED PROBLEM SOLVING APPROACH: CASE STUDY FOR A DELAMINATION DEFECT IN THE AUTOMOTIVE SEMICONDUCTOR INDUSTRYCorinne Berges20202020, vol.22, no.3
SRAM PHYSICAL FAILURE ANALYSIS CHALLENGES IN TECHNOLOGY NODES BEYOND 14 nmNoor Jehan Saujauddin; Kevin Davidson; Esther P. Y. Chen20202020, vol.22, no.3
SENSORIZATION: HOW MEMS TECHNOLOGY IS ENABLING OUR DIGITAL WORLDTimothy Brosnihan20202020, vol.22, no.3
I HAD A DREAMDavid Burgess20202020, vol.22, no.2
SUSTAINABLE 3D PRINTED SUPER MAGNETSNicholas Antoniou20202020, vol.22, no.2
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