期刊


ISSN1537-0755
刊名Electronic Device Failure Analysis
参考译名电子设备故障分析
收藏年代2004～2024



全部

2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2014 2015
2016 2017 2018 2019 2020 2021
2022 2023 2024

2018, vol.20, no.1 2018, vol.20, no.2 2018, vol.20, no.3 2018, vol.20, no.4

题名作者出版年年卷期
FAILURE ANAMNESIS: THE SYSTEM CHALLENGE IN FA AND RELIABILITYPeter Jacob20182018, vol.20, no.4
HUGE THERMOMETER TAKES TEMPERATURES OF TINY SAMPLESFelix Beaudoin20182018, vol.20, no.4
HIGH-RESOLUTION MICROSCOPY CONFIRMS NANOSCALE MAGNETIC PROPERTIESFelix Beaudoin20182018, vol.20, no.4
SCANNING ACOUSTIC MICROSCOPY: FROM LAB TO HIGH-THROUGHPUT FABFelix Beaudoin20182018, vol.20, no.4
KIRIGAMI-INSPIRED TECHNIQUE MANIPULATES LIGHT AT NANOSCALELarry Wagner20182018, vol.20, no.4
ANADEF 2018 WORKSHOP REPORTJulien Perraud20182018, vol.20, no.4
GEOLOCATION OF Cu WIRES DURING SENSITIVE IC ACID DECAPSULATIONMichael Obein20182018, vol.20, no.4
ADVANCED PACKAGING FAULT ISOLATION CASE STUDIES AND ADVANCEMENT OF EOTPRJesse Alton; Thomas White; Martin Igarashi20182018, vol.20, no.4
EARLY LIFE AUTOMOTIVE ELECTRONICS FAILURES AND THEIR ROOT CAUSESPeter Jacob20182018, vol.20, no.4
HIGH RESOLUTION ACOUSTIC GHz MICROSCOPYSebastian Brand; Michael Kogel; Frank Altmann20182018, vol.20, no.4
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