期刊


ISSN1537-0755
刊名Electronic Device Failure Analysis
参考译名电子设备故障分析
收藏年代2004～2024



全部

2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2014 2015
2016 2017 2018 2019 2020 2021
2022 2023 2024

2017, vol.19, no.1 2017, vol.19, no.2 2017, vol.19, no.3 2017, vol.19, no.4

题名作者出版年年卷期
CHALLENGES IN USING MOBILE DEVICES FOR AUTOMOTIVE ELECTRONICSE. Jan Vardaman; Linda Bal20172017, vol.19, no.1
FAILURE ANALYSIS ON SOLDERED BALL GRID ARRAYS: PART IGert Vogel20172017, vol.19, no.1
EDFAS BOARD OF DIRECTORS REPORTBill Vanderlinde20172017, vol.19, no.1
TELEDYNE LECROY INTRODUCES HIGH-DEFINITION OSCILLOSCOPELarry Wagner20172017, vol.19, no.1
NATIONAL INSTRUMENTS ANNOUNCES NEW OSCILLOSCOPELarry Wagner20172017, vol.19, no.1
TERAVIEW ADDS NEW TERAHERTZ APPLICATIONSLarry Wagner20172017, vol.19, no.1
SELF-SENSING CANTILEVERS AVAILABLE FOR AFSEMLarry Wagner20172017, vol.19, no.1
ECONO BOARD PROBES ENHANCE MEASUREMENTSLarry Wagner20172017, vol.19, no.1
3-D NANOPRINTING IMPROVES AFM PERFORMANCELarry Wagner20172017, vol.19, no.1
FEI OFFERS EFA WORKFLOW SOLUTIONSLarry Wagner20172017, vol.19, no.1
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