期刊


ISSN1537-0755
刊名Electronic Device Failure Analysis
参考译名电子设备故障分析
收藏年代2004～2024



全部

2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2014 2015
2016 2017 2018 2019 2020 2021
2022 2023 2024

2017, vol.19, no.1 2017, vol.19, no.2 2017, vol.19, no.3 2017, vol.19, no.4

题名作者出版年年卷期
SPEEDING UP FAILURE ANALYSIS USING FAB AND DESIGN DATARao Desineni; Yan Pan20172017, vol.19, no.4
THERMO FISHER SCIENTIFIC ADDS NEW FA PRODUCTSLarry Wagner20172017, vol.19, no.4
A VERMONT FARMER WALKS INTO A BAR...Dave Vallett20172017, vol.19, no.4
FAILURE ANALYSIS OF DC/DC CONVERTERS: A CASE STUDYJeremie Dhennin20172017, vol.19, no.4
PLASMA FIB DEPROCESSING OF INTEGRATED CIRCUITS FROM THE BACKSIDEE. L. Principe; Navid Asadizanjani; Domenic Forte; Mark Tehranipoor; Robert Chivas; Michael DiBattista; Scott Silverman20172017, vol.19, no.4
PRODUCT CIRCUIT VALIDATION AND FAILURE DEBUG: A SEMICONDUCTOR FOUNDRY CAN HELPEdy Susanto; S. H. Goh; Edmund C. Manlangit; Jeffrey Lam20172017, vol.19, no.4
NANOSCALE CAPACITANCE AND CAPACITANCE-VOLTAGE CURVES FOR ADVANCED CHARACTERIZATION OF ELECTRICAL PROPERTIES OF SILICON AND GaN STRUCTURES USING SCANNING MICROWAVE IMPEDANCE MICROSCOPY (sMIM)Oskar Amster; Stuart Friedman; Yongliang Yang; Fred Stanke20172017, vol.19, no.4
Peer-Reviewed Literature of Interest to Failure Analysis: Proximity and Near-Field TechniquesMichael R. Bruce20172017, vol.19, no.3
NONLINEAR OPTICAL CHARACTERIZATION OF NOVEL ELECTRONIC MATERIALSMing Lei; J. Price; Yujin Cho; Farbod Shafiei; M. C. Downer20172017, vol.19, no.3
NOVEL LENS ENABLES SUPERRESOLUTION IMAGINGLarry Wagner20172017, vol.19, no.3
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