期刊


ISSN1537-0755
刊名Electronic Device Failure Analysis
参考译名电子设备故障分析
收藏年代2004～2024



全部

2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2014 2015
2016 2017 2018 2019 2020 2021
2022 2023 2024

2016, vol.18, no.1 2016, vol.18, no.2 2016, vol.18, no.3 2016, vol.18, no.4

题名作者出版年年卷期
"WHAT STARTS HERE CHANGES THE WORLD:" RESEARCH HIGHLIGHTS FROM THE UNIVERSITY OF TEXAS AT AUSTIN, DEPARTMENT OF PHYSICSMichael R. Bruce20162016, vol.18, no.4
LVI AND LVP APPLICATIONS IN IN-LINE SCAN CHAIN FAILURE ANALYSISZhigang Song; Laura Safran20162016, vol.18, no.4
EMERGING TECHNIQUES FOR 2-D/2.5-D/3-D PACKAGE FAILURE ANALYSIS: EOTPR, 3-D X-RAY, AND PLASMA FIBChristian Schmidt; Jesse Alton; Martin Igarashi; Lisa Chan; Edward Principe20162016, vol.18, no.4
3-D TECHNOLOGY: FAILURE ANALYSIS CHALLENGESIngrid De Wolf20162016, vol.18, no.4
SUPERCONDUCTING SINGLE-PHOTON DETECTOR ENABLES TIME-RESOLVED EMISSION TESTING OF LOW-VOLTAGE SCALED ICsAndrea Bahgat Shehata; Franco Stellari; Peilin Song20162016, vol.18, no.4
2 5- AND 3-D TSV TECHNOLOGY APPLICATIONS AND FAILURE ANALYSIS CHALLENGESILihong Cao20162016, vol.18, no.3
THE ART AND SCIENCE OF INVENTION: BECOMING A BETTER INVENTORR. Aaron Falk20162016, vol.18, no.3
HIGH-VOLTAGE CAPACITOR FAILURE ON A DOWNHOLE OILFIELD PCBJohn Bescup20162016, vol.18, no.3
FEI LAUNCHES APREO HIGH-PERFORMANCE SEMLarry Wagner20162016, vol.18, no.3
BOARD OF DIRECTORS NEWS – EDFAS BOARD OF DIRECTORS REPORTBill Vanderlinde20162016, vol.18, no.3
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