期刊


ISSN0043-2288
刊名Welding in the World
参考译名世界焊接
收藏年代1999～2025



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024 2025

2025, vol.69, no.1 2025, vol.69, no.2 2025, vol.69, no.3 2025, vol.69, no.4 2025, vol.69, no.5 2025, vol.69, no.6

题名作者出版年年卷期
Microstructural evolution during low-temperature TLP bonding of WC-6Co cemented carbide to AISI 1045 steel using multi-layer of Ni/Cu/In/Cu/NiNahri, Saeid; Tavangar, RezaNahri, Saeid; Tavangar, Reza20252025, vol.69, no.6
Microstructure and mechanical characterization of diffusion-bonded CoCrCuFeNi HEA/TC4 titanium alloy joints using a Ni interlayer 20252025, vol.69, no.6
The impact of TiC particle addition to Ag-Cu-Ti filler material on the microstructure and mechanical properties of AlN ceramic/Cu brazed jointsQie, Lutong; Wang, Tao; Yu, Zhanlong; Guo, Weibing; Chen, XiaoguangQie, Lutong; Wang, Tao; Yu, Zhanlong; Guo, Weibing; Chen, Xiaoguang20252025, vol.69, no.6
Contact reaction brazing of TiAl alloy with Ti-Zr-V-Nb-Cu-Ni-Mn system high-entropy alloy filler metalFeng, Hongliang; Ren, Xinyu; Xiong, Huaping; Zhou, Biao; Zhai, Zhiliang; Ren, Haishui; Jing, Yongjuan; Qiu, Jiayu; Cheng, YaoyongFeng, Hongliang; Ren, Xinyu; Xiong, Huaping; Zhou, Biao; Zhai, Zhiliang; Ren, Haishui; Jing, Yongjuan; Qiu, Jiayu; Cheng, Yaoyong20252025, vol.69, no.6
Effect of Ge and In on the structure and thermodynamic characteristics of high-entropy MnCoNiCu alloysMaksymova, S. V.; Kovalchuk, P. V.; Voronov, V. V.; Karpets, M. V.; Naumenko, M. P.Maksymova, S. V.; Kovalchuk, P. V.; Voronov, V. V.; Karpets, M. V.; Naumenko, M. P.20252025, vol.69, no.6
Effects of local gas shielding on induction brazing of stainless steel: an experimental approachWeis, S.; Grunert, R.; Fedorov, V.; Brumm, S.; Uhlig, T.Weis, S.; Grunert, R.; Fedorov, V.; Brumm, S.; Uhlig, T.20252025, vol.69, no.6
Investigation of microstructure and mechanical properties of diffusion brazed boron carbide ceramics with Ni-Cr-Si-Fe-B-C filler alloyAmirnasiri, A.; Mirsalehi, S. E.Amirnasiri, A.; Mirsalehi, S. E.20252025, vol.69, no.6
Microstructure and properties of SnBiIn low-melting point solder doped with Ag particlesLiu, Zheng; Wu, Haodong; Yang, Li; Zhang, Yaocheng; Zhang, Yu; He, YucongLiu, Zheng; Wu, Haodong; Yang, Li; Zhang, Yaocheng; Zhang, Yu; He, Yucong20252025, vol.69, no.6
Study on properties of AgCuInTi filler metal for active bonding of alumina ceramicYuan, Linlin; Huang, Xiaomeng; Qi, Yuefeng; Liu, XuYuan, Linlin; Huang, Xiaomeng; Qi, Yuefeng; Liu, Xu20252025, vol.69, no.6
Microstructural evolution of sapphire/Kovar alloy joints brazed with Ag-Cu-Ti fillerYuan, Linlin; Zhang, Yinglong; Qi, Yuefeng; Huang, Xiaomeng; Liu, XuYuan, Linlin; Zhang, Yinglong; Qi, Yuefeng; Huang, Xiaomeng; Liu, Xu20252025, vol.69, no.6
123



国家科技图书文献中心  全球文献资源网  京ICP备05055788号-26  京公网安备11010202008970号  机械工业信息研究院 2018-2025