期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2025



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024 2025

2025, vol.37, no.1

题名作者出版年年卷期
Application and practice of LILCEO sintering proportion optimization algorithm in sintering plantYi, Lingzhi; Ren, Kai; Wang, Yahui; He, Wei; Zhang, Hui; Li, ZongpingYi, Lingzhi; Ren, Kai; Wang, Yahui; He, Wei; Zhang, Hui; Li, Zongping20252025, vol.37, no.1
Image segmentation on void regional formation in the flip-chip underfilling process by comparing YOLO and mask RCNNLing, Calvin; Chew, Cheng Kai; Abas, Aizat; Azahari, TaufikLing, Calvin; Chew, Cheng Kai; Abas, Aizat; Azahari, Taufik20252025, vol.37, no.1
Advancing packaging technology: computational fluid dynamics modeling for capillary underfill encapsulant in multi-chip heterogenous packagesAzman, Muhammad Aqil; Abdullah, Mz; Loh, Wei Keat; Ooi, Chun KeangAzman, Muhammad Aqil; Abdullah, Mz; Loh, Wei Keat; Ooi, Chun Keang20252025, vol.37, no.1
Exploring porosity effects of on mechanical behavior of sintered nanosilver for double-sided cooling packaging of high-power devices: a multiscale modelingLong, Xu; Zhao, Xianyi; Chong, Kainan; Su, Yutai; Siow, Kim S.; Wang, Zhi; Jia, Fengrui; Wan, XinLong, Xu; Zhao, Xianyi; Chong, Kainan; Su, Yutai; Siow, Kim S.; Wang, Zhi; Jia, Fengrui; Wan, Xin20252025, vol.37, no.1
Effect of adding Ni nanoparticles on the melting characteristics, mechanical properties and intermetallic compound growth of Sn58Bi solderZhang, Jiamin; Zhang, Liang; Huang, Xi; Wu, Chuanjiang; Deng, Kai; Long, Wei-MinZhang, Jiamin; Zhang, Liang; Huang, Xi; Wu, Chuanjiang; Deng, Kai; Long, Wei-Min20252025, vol.37, no.1
Wettability and microstructure transformations of YAG ceramic brazing to kovar alloy with AgCuTi filler alloyLin, Wei; Wang, Cheng; Zou, Qingyi; Lei, Min; Li, YulongLin, Wei; Wang, Cheng; Zou, Qingyi; Lei, Min; Li, Yulong20252025, vol.37, no.1
Comparative study of machine learning method and response surface methodology in BGA solder joint parameter optimizationLiu, Fang; Duan, Zhongwei; Gong, Runze; Zhou, Jiacheng; Wu, Zhi; Yan, NuLiu, Fang; Duan, Zhongwei; Gong, Runze; Zhou, Jiacheng; Wu, Zhi; Yan, Nu20252025, vol.37, no.1



国家科技图书文献中心  全球文献资源网  京ICP备05055788号-26  京公网安备11010202008970号  机械工业信息研究院 2018-2025