期刊


ISSN0972-7396
刊名MTT
参考译名今日制造技术
收藏年代2009～2024



全部

2009 2010 2011 2012 2013 2014
2015 2016 2017 2018 2019 2020
2021 2022 2023 2024

2024, vol.23, no.1/2 2024, vol.23, no.11/12 2024, vol.23, no.3/4 2024, vol.23, no.5/6 2024, vol.23, no.7/8 2024, vol.23, no.9/10

题名作者出版年年卷期
Design optimization of silicon cantilever for strain based MEMS position sensorG. N. Vikas; Megha Agrawal20242024, vol.23, no.3/4
Study on the effect of substrate material on the mechanical strength of Cu bonds bonded through flip chip bondingN. Chaitra; C. B. Harshitha; S. Harsha; Ajay Jaswal20242024, vol.23, no.3/4
Resolving fabrication issues in photolithography and thin film depositionBabu Angadi; S. Mahalakshmi; D. Devika Bai; Prabhanjan D. Kulkarni; S. Harsha20242024, vol.23, no.3/4



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