期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2024, vol.36, no.1 2024, vol.36, no.2 2024, vol.36, no.3

题名作者出版年年卷期
Thermal fatigue life prediction and intermetallic compound behaviour of SAC305 BGA solder joints subject to accelerated thermal cycling testApalowo, Rilwan Kayode; Abas, Mohamad Aizat; Ani, Fakhrozi Che; Mukhtar, Abdul Fatah Muhamed; Ramli, Mohamad Riduwan20242024, vol.36, no.3
A study on the thermomechanical response of various die attach metallic materials of power electronicsGharaibeh, Mohammad A.; Wilde, Juergen20242024, vol.36, no.3
Effect of Ce and Sb doping on microstructure and thermal/mechanical properties of Sn-1.0Ag-0.5Cu lead-free solderLiu, Fang; Wang, Zilong; Zhou, JiaCheng; Wu, Yuqin; Wang, Zhen20242024, vol.36, no.3
Improvement of SAC0307/Cu column friction plunge micro-welding quality by static constraintLi, Zhenkun; Zhao, Zhili; Liu, Jinliang; Ding, Xin20242024, vol.36, no.3
Electric current stressing enhanced damping properties in Sn5Sb solderLiu, Linqiang; Chen, Feng; Li, Wangyun20242024, vol.36, no.3
A temperature control method of hot-bar soldering based on extended Kalman filterZeng, Min; Xie, Jianxing; Li, Zhitao; Wei, Qincheng; Yang, Hui20242024, vol.36, no.3



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