期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2025



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024 2025

2024, vol.36, no.1 2024, vol.36, no.2 2024, vol.36, no.3 2024, vol.36, no.4 2024, vol.36, no.5

题名作者出版年年卷期
Investigation of the mechanical properties of lead-free Sn-58Bi solder alloy with cobalt addition through flux dopingKamaruzzaman, Lina Syazwana; Goh, Yingxin; Goh, Yi ChungKamaruzzaman, Lina Syazwana; Goh, Yingxin; Goh, Yi Chung20242024, vol.36, no.5
Numerical modeling and optimization of fillet height of reinforced SAC305 solder joint in an ultra-fine capacitor assemblyApalowo, Rilwan Kayode; Mukhtar, Muhamed Abdul Fatah Muhamed; Abas, Mohamad Aizat; Ani, Fakhrozi CheApalowo, Rilwan Kayode; Mukhtar, Muhamed Abdul Fatah Muhamed; Abas, Mohamad Aizat; Ani, Fakhrozi Che20242024, vol.36, no.5
Effect of different beam distances in laser soldering process: a numerical and experimental studyNazarudin, Muhammad Zaim Hanif; Abas, Mohamad Aizat; Kamil, Wan Maryam Wan Ahmad; Nadzri, Faiz Farhan Ahmad; Zahiri, Saifulmajdy A.; Sharif, Mohamad Fikri Mohd; Ani, Fakhrozi Che; Zawawi, Mohd HafizNazarudin, Muhammad Zaim Hanif; Abas, Mohamad Aizat; Kamil, Wan Maryam Wan Ahmad; Nadzri, Faiz Farhan Ahmad; Zahiri, Saifulmajdy A.; Sharif, Mohamad Fikri Mohd; Ani, Fakhrozi Che; Zawawi, Mohd Hafiz20242024, vol.36, no.5
Effect of the solder conductive particles and substrate widths on the current carrying capability for flex-on-board (FOB) assemblyPan, Yan; Zhang, Shuye; Zhu, Pengli; Paik, Kyung W.Pan, Yan; Zhang, Shuye; Zhu, Pengli; Paik, Kyung W.20242024, vol.36, no.5
Interfacial IMC growth behavior of Sn-3Ag-3Sb-xIn solder on Cu substrateZhou, Jiacheng; Shi, Jinglin; Xu, Lei; Zhang, Fuwen; Wang, Zhigang; Hu, Qiang; He, HuijunZhou, Jiacheng; Shi, Jinglin; Xu, Lei; Zhang, Fuwen; Wang, Zhigang; Hu, Qiang; He, Huijun20242024, vol.36, no.5
Influence of annealing temperature on 3D surface stereometric analysis in C-Ni filmsDalouji, Vali; Rahimi, NasimDalouji, Vali; Rahimi, Nasim20242024, vol.36, no.5
Formation and growth mechanism of thin Cu 6 Sn 5 films in Sn/Cu and Sn-0.1AlN/Cu structures using laser heatingLiang, ZhangLiang, Zhang20242024, vol.36, no.5
Effects of soldering temperatures and composition on the microstructures and shear properties of Sn58Bi-xSAC0307/ENIG solder jointsJiang, Mengxia; Liu, Yang; Xue, Yuxiong; Shan, Guangbao; Lv, Jun; Huang, Mairui20242024, vol.36, no.4
Ag-based filler metal wetting behavior and brazed joint performance on SLMed Ti/TiB 2 substrateWang, Liuyong; Wu, Qi; Song, Ziming; Li, Yue; Li, Xuewen; Tu, Bing; Li, Yulong20242024, vol.36, no.4
Robust vision detection of pipeline solder jointsAn, Huijun; Kong, Lingbao20242024, vol.36, no.4
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