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期刊
ISSN
0043-2288
刊名
Welding in the World
参考译名
世界焊接
收藏年代
1999~2024
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2023, vol.67, no.1
2023, vol.67, no.10
2023, vol.67, no.11
2023, vol.67, no.12
2023, vol.67, no.2
2023, vol.67, no.3
2023, vol.67, no.4
2023, vol.67, no.5
2023, vol.67, no.6
2023, vol.67, no.7
2023, vol.67, no.8
2023, vol.67, no.9
题名
作者
出版年
年卷期
Evaluation of hardness and impact toughness of drawn arc stud weldments on different structural steel grades
Braetz, Oliver; Henkel, Knuth-Michael
2023
2023, vol.67, no.5
Wide gap brazing of NIMONIC 105 superalloy using BNi-2 filler and the effect of post braze heat treatment on joint properties
Barazandeh, Reza; Mofid, Mohammad Ammar; Jafarzadegan, Mostafa; Vatan, Hadi Nasiri
2023
2023, vol.67, no.5
Influence of alloying elements and cooling rate on the presence of delta ferrite in modified 9Cr-1Mo as-welded microstructure produced by gas-metal arc welding
Mahlalela, S. S.; Pistorius, P. G. H.
2023
2023, vol.67, no.5
Thermal influence of resistance spot welding on a nearby overmolded thermoplastic-metal joint (vol 67, pg 793, 2023)
Wippermann, Jan; Meschut, Gerson; Koshukow, Wikentij; Liebsch, Alexander; Gude, Maik; Minch, Steven; Kolbe, Bjoern
2023
2023, vol.67, no.5
Microstructure and mechanical properties characterization of aged and repair welded Alloy 617M
Unikela, Bhavana; Dey, Harish Chandra; Albert, Shaju K.
2023
2023, vol.67, no.5
Effects of Ge on microstructure evolution of the Cu-based filler metal and the Cu-20Sn-10Ti-1Ga/diamond brazing mechanism
Cui, Bing; Yan, Peipei; Liu, Zhengwei; Zhang, Xue; Hu, Lei; Tong, Baohong; Du, Quanbin
2023
2023, vol.67, no.5
Bead shape control in high-speed fillet welding using hot-wire GMA laser hybrid welding technology
Tamata, H.; Fujinaga, A.; Takahashi, T.; Yamamoto, H.; Choi, J.; Yamamoto, M.; Marumoto, K.
2023
2023, vol.67, no.5
Investigation of the effects of filler metal and number of passes used in AISI 304 stainless steel-copper joints by TIG welding
Yaz, Semih Okan; Yilmaz, Eren
2023
2023, vol.67, no.5
Pulse-pressure diffusion bonding of Ti-6Al-4 V alloy with nanostructured Cu-W multilayer film as interlayer
Li, Hong; Li, Bo-jin; Xing, Zeng-cheng; Hodulova, Erika; Wang, Yi-peng; Lehmert, Benjamin; Li, Zhuo-xin; Tillmann, Wolfgang
2023
2023, vol.67, no.5
Analysis of solder mask roughness and stencil shape influence on void formation in solder joints
Kozak, Martin; Vesely, Petr; Dusek, Karel
2023
2023, vol.67, no.5
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