期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2023, vol.145, no.1 2023, vol.145, no.2 2023, vol.145, no.3

题名作者出版年年卷期
Experimental and Numerical Investigations of Intermittence for Electronic Connectors Subjected to Mechanical ShocksHuang, T. -C; Liao, K. -C20232023, vol.145, no.1
Reliability of State-of-Health of the Flexible Li-Ion Batteries Under Various Flexing Conditions and Calendar AgingLall, Pradeep; Jang, Hyesoo20232023, vol.145, no.1
Module-Level Thermal Interface Material Degradation in HALTTompkins, Joshua; Garcia, Alicia Medina; Huitink, David; Liao, Haitao20232023, vol.145, no.1
Interaction of Surface Preparation and Cure Parameters on the Interface Reliability of Flexible Encapsulation in Flexible Hybrid Electronics ApplicationsLall, Pradeep; Choudhury, Padmanava; Miller, Scott20232023, vol.145, no.1
The Discussion About the Identification of the Anand Model Parameters and Two Alternative Identification MethodsXu, Yuqian; Zeng, Qiwen; Wang, Yuexing; Wu, Mingyong; Chen, Xiangyu; Chen, Gang20232023, vol.145, no.1
HFE7500 Coolant Dielectric Strength Augmentation Under Convective ConditionsMiljkovic, Nenad; Iradukunda, Ange Christian; Huitink, David; Kayijuka, Kevin; Gebrael, Tarek20232023, vol.145, no.1
Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress-Atomic Coupled ModelKato, Mitsuaki; Omori, Takahiro; Goryu, Akihiro; Fumikura, Tomoya; Hirohata, Kenji20232023, vol.145, no.1
Transient Nature of Flight and Its Impact on Thermal Management for All Electric AircraftKasitz, Joshua; Lad, Aniket Ajay; Hoque, Muhammad Jahidul; Miljkovic, Nenad; Huitink, David20232023, vol.145, no.1
Viscoelastic Influence on the Board Level Assessment of Wafer Level Packages Under Drop Impact and Under Thermal CyclingMisrak, Abel; Bhandari, Rabin; Agonafer, Dereje20232023, vol.145, no.1
Electrothermal Analysis of System in Package for Aerospace ApplicationSu, Hao-hang; Fu, Shuai; Li, Su-yuan; Bian, Jiang20232023, vol.145, no.1
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