期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2023, vol.35, no.1 2023, vol.35, no.2 2023, vol.35, no.3 2023, vol.35, no.4 2023, vol.35, no.5

题名作者出版年年卷期
Influence of bonding temperature on the properties of Cu/(SAC mixed powder)/Al joints under ultrasonic-assistedGan, Guisheng; Chen, Shi-qi; Liu, Cong; Ma, Peng; Huang, Tian; Cheng, Dayong; Liu, Xin; Jiang, Liujie20232023, vol.35, no.4
Hot tear cracks on the suppression of Sn-Bi alloy for low-temperature assemblyQu, Songtao; Shi, Qingyu20232023, vol.35, no.4
Introduction of non-linear fracture mechanics in the modelling of a flip-chip component under drop impactBelhenini, Soufyane; El Fatmi, Imad; Richard, Caroline; Tougui, Abdellah20232023, vol.35, no.4
Role of Cu percentage in the Sn-xCu alloy on the mechanical performance at Sn-xCu/ENIG interface produced by laser solderingAbdullah, Muhammad Asyraf; Idris, Siti Rabiatull Aisha20232023, vol.35, no.4
Wetting kinetics, spreading phenomena and interfacial reaction of Sn-15Bi-xZn solders on Cu substrate at different temperaturesLin, Wei; Li, Xuewen; Tu, Bing; Zhang, Chaohua; Li, Yulong20232023, vol.35, no.4
Drop and impact reliability investigation of BGA and LGA interconnectsGharaibeh, Mohammad A.; Pitarresi, James M.20232023, vol.35, no.4



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