期刊


ISSN1063-7397
刊名Russian Microelectronics
参考译名俄罗斯微电子学
收藏年代2002~2024



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2014 2015 2016 2017 2018 2019
2020 2021 2022 2023 2024

2023, vol.52, no.1 2023, vol.52, no.2 2023, vol.52, no.3 2023, vol.52, no.4 2023, vol.52, no.5 2023, vol.52, no.6
2023, vol.52, no.7 2023, vol.52, no.8 2023, vol.52, no.Suppl.1

题名作者出版年年卷期
A Mass-in-Mass Chain and the Generalization of the Dirac Equation with an Eight-Component Wave Function and with Optical and Acoustic Branches of the Dispersion RelationTurin V.O.; Andreev P.A.; Cherepkova A.Y.; Kireev D.D.; Nazritsky I.V.; Ilyushina Y.V.Turin V.O.; Andreev P.A.; Cherepkova A.Y.; Kireev D.D.; Nazritsky I.V.; Ilyushina Y.V.20232023, vol.52, no.Suppl.1
2D Geometrical Parameters of Asymmetric Plasmonic Crescent-Shaped Nanostructures Fabricated with Colloidal Nanolithography 20232023, vol.52, no.Suppl.1
Terahertz All-Dielectric Metalens: Design and Fabrication Features 20232023, vol.52, no.Suppl.1
Artificial Magnetism in Theory of Wave Multiple Scattering by Random Ensemble of Nonmagnetic Spheres with Negative Dielectric Permittivity 20232023, vol.52, no.Suppl.1
Modeling and Improving the Transmission Efficiency of an Optical Beam Splitter Made of Silicon Nitride Si3N4 20232023, vol.52, no.Suppl.1
Modeling of Heat Transfer for a Three-Dimensional Microelectromechanical Mirror Element with Consideration of Its Packaging Features 20232023, vol.52, no.Suppl.1
Research and Analysis of Thermomechanical Stresses in the Structure of a Wafer with Embedded ICs with Consideration of Temperature Effects in Manufacturing Process Route 20232023, vol.52, no.Suppl.1
Peculiarities of Generation of Broadband Two-Photon States in Lithium Niobate Nanowaveguide 20232023, vol.52, no.Suppl.1
Hybrid Atom-Ion Quantum Gate Engineering 20232023, vol.52, no.Suppl.1
Accounting for Carrier Mobility Reduction due to the Normal Field in the Saturation Current Modeling of Extrinsic MOSFETs 20232023, vol.52, no.Suppl.1
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