期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2022, vol.34, no.1 2022, vol.34, no.2 2022, vol.34, no.3 2022, vol.34, no.4 2022, vol.34, no.5

题名作者出版年年卷期
Impact of different aging conditions on the IMC layer growth and shear strength of Ni-modified MWCNTs reinforced Sn-Ag-Cu composite solderZhai, Xinmeng; Chen, Yue; Li, Yuefeng20222022, vol.34, no.3
Microstructural and compositional evolution of SAC305/TiN composite solder under thermal stressingChen, Guang; Wu, Yao-Feng20222022, vol.34, no.3
Effects of Sn-Ag-x leveling layers on the microstructure and mechanical properties of SnBi low-temperature solder jointsLiu, Yang; Xue, Yuxiong; Zhou, Min; Cao, Rongxing; Zeng, Xianghua; Li, Hongxia; Zheng, Shu; Zhang, Shuang20222022, vol.34, no.3
Design criteria for pad and stencil with high pick-and-Place yieldHuang, Chien-Yi; Chan, Chao-Chieh; Wang, Ping-Sen; Greene, Christopher20222022, vol.34, no.3
Cu3Sn-microporous copper composite joint for high-temperature die-attach applicationsPan, Zhen; Sun, Fenglian20222022, vol.34, no.3
A study on the effects of electrical and thermal stresses on void formation and migration lifetime of Sn3.0Ag0.5Cu solder jointsLi, Yanruoyue; Fu, Guicui; Wan, Bo; Wu, Zhaoxi; Yan, Xiaojun; Zhang, Weifang20222022, vol.34, no.3



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