期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2022, vol.34, no.1 2022, vol.34, no.2 2022, vol.34, no.3 2022, vol.34, no.4 2022, vol.34, no.5

题名作者出版年年卷期
Wetting characteristics of Sn-5Sb-CuNiAg lead-free solders on the copper substrateWang Xiuqi; Sun Fenglian; Han Bangyao; Cao Yilun; Du Jinyang; Liu Guohuai; Shao Long20222022, vol.34, no.2
Effect of external static magnetic field on the particle distribution, the metallurgical process and the microhardness of Sn3.5Ag solder with magnetic Ni particlesWang Jianhua; Xu Hongbo; Zhou Li; Liu Ximing; Zhao Hongyun20222022, vol.34, no.2
Defect patterns study of pick-and-place machine using automated optical inspection dataHe Jingxi; Won Daehan; Cen Yuqiao20222022, vol.34, no.2
Effects of doping trace Ni element on interfacial behavior of Sn/Ni (polycrystal/single-crystal) jointsWang Jianing; Chen Jieshi; Zhang Zhiyuan; Zhang Peilei; Yu Zhishui; Zhang Shuye20222022, vol.34, no.2
Microstructures evolution and growth kinetics of intermetallic compounds in Cu/Sn/Cu system during ultrasonic soldering processHan Xu; Li Xiaoyan; Yao Peng20222022, vol.34, no.2
Influence of moisture concentration and hydrophobic material on induced stress in FCBGA package under reflowHeng Elwin; Abdullah Mohd Zulkifly20222022, vol.34, no.2
Effect of different soldering temperatures on the properties of COB light sourceWang Zhao; Li Yuefeng; Zou Jun; Yang Bobo; Shi Mingming20222022, vol.34, no.2



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