期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



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1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2022, vol.34, no.1 2022, vol.34, no.2 2022, vol.34, no.3 2022, vol.34, no.4 2022, vol.34, no.5

题名作者出版年年卷期
Reliability modeling and assessment of solder joints of electronic assemblies under mixed exposure to mechanical loadsSupriyono; Chen, Tzu-Chia; Yapanto, Lis M.; Zekiy, Angelina Olegovna; Melnikova, Lyubov A.; Thangavelu, Lakshmi; Surendar, A.; Repnikov, Nikolay I.; Arzehgar, Zeinab; Latipov, Zagir Azgarovich20222022, vol.34, no.1
Model updating of a temperature field simulation of a printed circuit board assembly based on the Kriging modelYin, Yutian; Zhou, Hongda; Chen, Cai; Zheng, Yi; Shen, Hongqiao; Gong, Yubing20222022, vol.34, no.1
Accurate composition dependent thermo mechanical lifetime estimation of hour glass type solder joint in electronic assembliesOlenev, Leonid Anatolevich; Zakieva, Rafina Rafkatovna; Smirnova, Nina Nikolaevna; Shichiyakh, Rustem Adamovich; Ershov, Kirill Aleksandrovich; Geetha, Nisith20222022, vol.34, no.1
Effect of microwave operating power and reflow time on the microstructure and tensile properties of Sn-3.0Ag-0.5Cu/Cu solder jointsSaid, Mardiana; Mohd Nazeri, Muhammad Firdaus; Mohd Sharif, Nurulakmal; Mohamad, Ahmad Azmin20222022, vol.34, no.1
Local solidification thermal parameters affecting the eutectic extent in Sn-Cu and Sn-Bi solder alloysKakitani, Rafael; Pinto da Silva, Cassio Augusto; Silva, Bismarck; Garcia, Amauri; Cheung, Noe; Spinelli, Jose Eduardo20222022, vol.34, no.1
Electronic component detection based on image sample generationWu, Hao; Lv, Quanquan; Yang, Jiankang; Yan, Xiaodong; Xu, Xiangrong20222022, vol.34, no.1
Experimental measurements of the shear force on surface mount components simulating the wave soldering processCarvalho, Violeta; Arcipreste, Bruno; Soares, Delfim; Ribas, Luis; Rodrigues, Nelson; Teixeira, Senhorinha; Teixeira, Jose C.20222022, vol.34, no.1



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