期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志;美国机械工程师学会汇刊
收藏年代1995~2024



全部

1995 1996 1997 1998 1999 2000
2001 2002 2003 2004 2005 2006
2007 2008 2009 2010 2011 2012
2013 2014 2015 2016 2017 2018
2019 2020 2021 2022 2023 2024

2021, vol.143, no.1 2021, vol.143, no.2 2021, vol.143, no.3 2021, vol.143, no.4

题名作者出版年年卷期
Machine Learning-Based Predictions of Benefits of High Thermal Conductivity Encapsulation Materials for Power Electronics PackagingAcharya, Palash, V; Lokanathan, Manojkumar; Ouroua, Abdelhamid; Hebner, Robert; Strank, Shannon; Bahadur, Vaibhav20212021, vol.143, no.4
Experimental Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of ElectronicsGhaffari, Omidreza; Tong, Wei; Larimi, Yaser Nabavi; al Sayed, Chady; Genieli, Alireza; Morissette, Jean-Francois; Grenier, Francis; Jasmin, Simon; Frechette, Luc; Sylvestre, Julien20212021, vol.143, no.4
Experimental Analysis and Modeling of a Novel Thermosyphon System for Electronics CoolingCataldo, Filippo; Crea, Yuri Carmelo20212021, vol.143, no.4
Effect of Phase Change Material on Dynamic Thermal Management Performance for Power Electronics PackagesHollis, Justin; Sharar, Darin J.; Bandhauer, Todd20212021, vol.143, no.4
Reduced Order Design Optimization of Liquid Cooled Heat SinksLad, Aniket Ajay; James, Kai A.; King, William P.; Miljkovic, Nenad20212021, vol.143, no.4
Special Issue Dedicated to Professor Avram Bar-CohenWarzoha, Ronald J.; Sharar, Darin J.; Amalfi, Raffaele Luca; Tay, Andrew20212021, vol.143, no.4
Guidelines for Designing Micropillar Structures for Enhanced Evaporative Heat TransferGuye, Kidus; Dong, De; Kim, Yunseo; Lee, Hyoungsoon; Dogruoz, Baris; Agonafer, Damena20212021, vol.143, no.4
Peak Temperature Mitigation of a Multimicrochannel Evaporator Under Transient Heat LoadsAnderson, Caleb; Richey, Joshua; Fish, Michael; Bandhauer, Todd20212021, vol.143, no.4
The Effect of Uneven Heating on the Flow Distribution Between Parallel Microchannels Undergoing BoilingMiglani, Ankur; Soto, Anali; Weibel, Justin A.; Garimella, Suresh, V20212021, vol.143, no.4
Viability of Cryogenic Cooling to Reduce Processor Power ConsumptionNordlund, Alec; Harrison, Matthew; Gess, Joshua20212021, vol.143, no.4
12