期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2021, vol.33, no.1 2021, vol.33, no.2 2021, vol.33, no.3 2021, vol.33, no.4 2021, vol.33, no.5

题名作者出版年年卷期
The effect of Bi addition on the electrical and microstructural properties of SAC405 soldered structureSoares, Delfim; Sarmento, Manuel; Barros, Daniel; Peixoto, Helder; Figueiredo, Hugo; Alves, Ricardo; Delgado, Isabel; Teixeira, Jose C.; Cerqueira, Fatima20212021, vol.33, no.1
Mechanical reliability of self-aligned chip assembly after reflow soldering processMokhtar, Mohd Najib Ali; Abdullah, M. Z.; Saad, Abdullah Aziz; Cheani, Fakhrozi20212021, vol.33, no.1
Reliability assessment of ball grid array joints under combined application of thermal and power cycling: solder geometry effectKurrrar, Sathish; Kuzichkin, Oleg R.; Siddiqi, Ahmed Faisal; Pustokhina, Inna; Krasnopevtsev, Aleksandr Yu20212021, vol.33, no.1
Performance of 96.5Sn-3Ag-0.5Cu/fullerene composite solder under isothermal ageing and high-current stressingChen, Guang; Cui, Xinzhan; Wu, Yaofeng; Li, Wei; Wu, Fengshun20212021, vol.33, no.1
Device architecture optimization of solder ball joints fatigue lifetime under random vibration frequenciesGao, Yang; Wang, Fuwei; Ding, Shaohu; Yang, Bin; Liu, Lin; Salmani, Mohammad20212021, vol.33, no.1
Influence of aging on microstructure and hardness of lead-free solder alloysMorando, Carina; Fornaro, Osvaldo20212021, vol.33, no.1
Microstructural evolution and micromechanical properties of SAC305/CNT/CU solder joint under blast wave conditionIsmail, Norliza; Jalar, Azman; Abu Bakar, Maria; Safee, Nur Shafiqa; Yusoff, Wan Yusmawati Wan; Ismail, Ariffin20212021, vol.33, no.1



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