期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2020, vol.142, no.1 2020, vol.142, no.2 2020, vol.142, no.3 2020, vol.142, no.4

题名作者出版年年卷期
Reviewer’s Recognition 20202020, vol.142, no.2
Investigation of Strip Warpage Behavior in Wire Bonding ProcessChuang, Wan-Chun; Chen, Wei-Long20202020, vol.142, no.2
High Temperature Performance Evaluation and Life Prediction for Titanium Modified Silicone Used in Light-Emitting Diodes Chip Scale PackagesYu, Si; Wang, Zhen; Fan, Jiajie; Qian, Cheng; Deng, Zhentao; Gui, Dayong20202020, vol.142, no.2
Investigation of Elevated Temperature Mechanical Properties of Intermetallic Compounds in the Cu–Sn System Using NanoindentationYin, Zuozhu; Sun, Fenglian; Guo, Mengjiao20202020, vol.142, no.2
Experimental Description of Information Technology Equipment Reliability Exposed to a Data Center Using Airside Economizer Operating in Recommended and Allowable ASHRAE Envelopes in an ANSI/ISA Classified G2 EnvironmentAwe, Oluwaseun; Shah, Jimil M.; Agonafer, Dereje; Singh, Prabjit; Kannan, Naveen; Kaler, Mike20202020, vol.142, no.2
Electrical Joining of Paper-Based Multilayer Magneto-Resistive Sensor StacksAkin, Meriem; Blackburn, Jennifer; Pratt, Autumn; Dietzel, Andreas20202020, vol.142, no.2
Atomic Study on Copper–Copper Bonding Using NanoparticlesSong, Xiaohui; Zhang, Rui; Zhao, Huadong20202020, vol.142, no.2
Low-Temperature Bonding of Cu Through Self-Propagating Reaction Under Various Temperatures and PressuresZhu, Wenbo; Wang, Xiaoting; Li, Mingyu20202020, vol.142, no.2
Guidelines for Reduced-Order Thermal Modeling of Multifinger GaN HEMTsKim, Samuel; Graham, Samuel; Rattner, Alexander; Choi, Sukwon; Chatterjee, Bikramjit; Pearson, Robert20202020, vol.142, no.2
Lifetime Model for the Fatigue Fracture in Cu/Al2O3/Cu Composites: Experimental Validation of a Substantial Lifetime Enhancement by Cu Step EtchingGaiser, Patrick; Klingler, Markus; Wilde, Jürgen20202020, vol.142, no.2
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