期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2020, vol.142, no.1 2020, vol.142, no.2 2020, vol.142, no.3 2020, vol.142, no.4

题名作者出版年年卷期
Fatigue Prediction for Molded Wafer-Level Package During Temperature CyclingChuang, Wan-Chun; Chen, Wei-Long20202020, vol.142, no.1
Empirical High Cycle Fatigue Assessment Model of MEMS DevicesChang, Chia-Cheng; Chiang, Kuo-Ning20202020, vol.142, no.1
Additive-Manufactured Organic InterposersRoshanghias, A.; Krivec, M.; Bardong, J.; Binder, A.20202020, vol.142, no.1
Measurement of the Thermal Performance of a Custom-Build Single-Phase Immersion Cooled Server at Various High and Low Temperatures for Prolonged TimeBansode, Pratik, V; Shah, Jimil M.; Gupta, Gautam; Agonafer, Dereje; Patel, Harsh; Roe, David; Tufty, Rick20202020, vol.142, no.1
Low-Dielectric Constant Nanoporous Epoxy for Electronic PackagingJiang, Jisu; Keller, Landon; Kohl, Paul A.20202020, vol.142, no.1
Packaging for Laser-Based White Lighting: Status and PerspectivesMa, Yupu; Luo, Xiaobing20202020, vol.142, no.1
Microstructural Evolution and Protrusion Simulations of Cu-TSVs Under Different Loading ConditionsLiu, Jinxin; Huang, Zhiheng; Conway, Paul P.; Liu, Yang20202020, vol.142, no.1
Experimental Study on Thermal Contact Resistance Improvement for Optical Fiber by Using Low-Melting Temperature AlloyChu, Wen-Xiao; Lin, Hao-Yu; Wang, Chi-Chuan20202020, vol.142, no.1
Effect of Gas Flow Rates on Quality of Aerosol Jet Printed Traces With Nanoparticle Conducting InkDalal, Neil; Gu, Yuan; Chen, Guang; Hines, Daniel R.; Dasgupta, Abhijit; Das, Siddhartha20202020, vol.142, no.1
Novel Transient Liquid Phase Bonding for High-Temperature Automotive Power Electronics SystemsLiu, Yanghe; Joshi, Shailesh N.; Dede, Ercan M.20202020, vol.142, no.1
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