期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



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2018, vol.30, no.1 2018, vol.30, no.2 2018, vol.30, no.3 2018, vol.30, no.4

题名作者出版年年卷期
Guest editorialSkwarek, Agata20182018, vol.30, no.2
Convection vs vapour phase reflow in LED and BGA assemblyDziurdzia, Barbara; Sobolewski, Maciej; Mikolajek, Janusz20182018, vol.30, no.2
Investigating the attack angle of squeegees with different geometriesKrammer, Oliver; Jakab, Laszlo; Illes, Balazs; Busek, David; Pelikanova, Ivana Beshajova20182018, vol.30, no.2
Residual free solder process for fluxless solder pastesHanss, Alexander; Elger, Gordon20182018, vol.30, no.2
Effects of high current density on lead-free solder joints of chip-size passive SMD componentsGeczy, Attila; Straubinger, Daniel; Kovacs, Andras; Krammer, Oliver; Mach, Pavel; Harsanyi, Gabor20182018, vol.30, no.2
In-Bi low-temperature SLID bonding for piezoelectric materialsEggen, Trym; Manh, Tung; Hoang-Vu Nguyen; Aasmundtveit, Knut E.20182018, vol.30, no.2
Effect of the vapour concentration decrease on the solder joints temperature in a vacuum vapour phase soldering systemIlles, Balazs; Skwarek, Agata; Geczy, Attila; Jakab, Laszlo; Busek, David; Dusek, Karel20182018, vol.30, no.2
Characterisation of Cu/Cu bonding using self-assembled monolayerLykova, Maria; Panchenko, Iuliana; Kuenzelmann, Ulrich; Reif, Johanna; Geidel, Marion; Wolf, M. Juergen; Lang, Klaus-Dieter20182018, vol.30, no.2
The influence of a soldering manner on thermal properties of LED modulesGorecki, Krzysztof; Dziurdzia, Barbara; Ptak, Przemyslaw20182018, vol.30, no.2
Fine line screen printed silver electrodes for copper electrodepositionDrabczyk, Kazimierz20182018, vol.30, no.2



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