期刊


ISSN1474-0893
刊名Global SMT & Packaging
参考译名全球表面装配技术与包装——欧洲版
收藏年代2004～2024

关联期刊参考译名收藏年代
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2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2016 2017
2018 2019 2020 2021 2022 2023
2024

2017, vol.17, no.1 2017, vol.17, no.10 2017, vol.17, no.12 2017, vol.17, no.2 2017, vol.17, no.3 2017, vol.17, no.4
2017, vol.17, no.5 2017, vol.17, no.7 2017, vol.17, no.9

题名作者出版年年卷期
Precise, High-Throughput Underfill Dispense In Chip-On-Wafer PackagingHANZHUANG LIANG20172017, vol.17, no.7
Room Temperature Fast Flow Reworkable Underfill For LGAMARY LIU; WUSHENG YIN20172017, vol.17, no.7
Fast Alignment Systems Speed Up Silicon Photonics Device TestingSCOTT JORDAN; STEFAN VORNDRAN20172017, vol.17, no.7
Flip Chip LED Assembly by Solder Stamping/Pin-TransferGYAN DUTT; SRINATH HIMANSHU; NICHOLAS HERRICK; AMIT PATEL; RANJIT PANDHER20172017, vol.17, no.7
Impact of Substrate Materials On Reliability of High Power LED AssembliesRANJIT PANDHER; RAVI BHATKAL; KURT-JURGEN LANG20172017, vol.17, no.7
Tracking the South African Electronics IndustryCHERYL TULKOFF20172017, vol.17, no.7



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