期刊


ISSN0960-1317
刊名Journal of Micromechanics and Microengineering
参考译名微型机械与微型工程学报
收藏年代2006～2025



全部

2006 2007 2008 2009 2010 2011
2012 2013 2014 2015 2016 2017
2018 2019 2020 2021 2022 2023
2024 2025

2017, vol.27, no.1 2017, vol.27, no.10 2017, vol.27, no.11 2017, vol.27, no.12 2017, vol.27, no.2 2017, vol.27, no.3
2017, vol.27, no.4 2017, vol.27, no.5 2017, vol.27, no.6 2017, vol.27, no.7 2017, vol.27, no.8 2017, vol.27, no.9

题名作者出版年年卷期
Electrowetting-actuated liquid metal for RF applicationsDiebold, A. V.; Watson, A. M.; Holcomb, S.; Tabor, C.; Mast, D.; Dickey, M. D.; Heikenfeld, J.20172017, vol.27, no.2
Light-absorbent liquid immersion angled exposure for patterning 3D samples with vertical sidewallsKumagai, Shinya; Kubo, Hironori; Sasaki, Minoru20172017, vol.27, no.2
Tunable diffraction grating in flexible substrate by UV-nanoimprint lithographyHamouda, F.; Aassime, A.; Bertin, H.; Bartenlian, B.; Dagens, B.; Gogol, P.20172017, vol.27, no.2
Experimental and theoretical analysis of defocused CO2 laser microchanneling on PMMA for enhanced surface finishPrakash, Shashi; Kumar, Subrata20172017, vol.27, no.2
Microelectromechanical system-based electrochemical seismic sensors with an anode and a cathode integrated on one chipDeng, T.; Sun, Z.; Li, G.; Chen, J.; Chen, D.; Wang, J.20172017, vol.27, no.2
Fabricating and controlling PCL electrospun microfibers using filament feeding melt electrospinning techniqueKo, Junghyuk; Ahsani, Vahid; Yao, Selina Xiangxiao; Mohtaram, Nima K.; Lee, Patrick C.; Jun, Martin B. G.20172017, vol.27, no.2
Design, fabrication, and characterization of bridge-type micro-hotplates with an SU-8 supporting layer for a smart gas sensing systemIwata, T.; Soo, W. P. C.; Matsuda, K.; Takahashi, K.; Ishida, M.; Sawada, K.20172017, vol.27, no.2
Fabrication and electrical characterization of sub-micron diameter through-silicon via for heterogeneous three-dimensional integrated circuitsAbbaspour, R.; Brown, D. K.; Bakir, M. S.20172017, vol.27, no.2
Aluminum-based one- and two-dimensional micro fin array structures: high-throughput fabrication and heat transfer testingPrimeaux, Philip A.; Zhang, Bin; Zhang, Xiaoman; Miller, Jacob; Meng, W. J.; Pratik, K. C.; Moore, Arden L.20172017, vol.27, no.2
A double-lithography and double-reflow process and application to multi-pitch multi-height mechanical flexible interconnectsZhang, Chaoqi; Yang, Hyung Suk; Bakir, Muhannad S.20172017, vol.27, no.2
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