期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2017, vol.29, no.1 2017, vol.29, no.2 2017, vol.29, no.3 2017, vol.29, no.4

题名作者出版年年卷期
Geometric size effect on IMC growth and elements diffusion in Cu/Sn/Cu solder jointsZhu, Yan; Sun, Fenglian20172017, vol.29, no.2
Effect of nano-Cu addition on microstructure evolution of Sn0.7Ag0.5Cu-BiNi/Cu solder jointBan, Gaofang; Sun, Fenglian; Liu, Yang; Cong, Shaonan20172017, vol.29, no.2
Wetting properties of Nd:YAG laser treated copper by SAC soldersHlinka, Jozsef; Berczeli, Miklos; Buza, Gabor; Weltsch, Zoltan20172017, vol.29, no.2
Deformation behaviour of Sn-3.0Ag-0.5Cu (SAC305) solder wire under varied tensile strain ratesAbdullah, Izhan; Zulkifli, Muhammad Nubli; Jalar, Azman; Ismail, Roslina20172017, vol.29, no.2
Investigation and prediction of solder joint failure analysis for ball grid array package subject to mechanical bending environmentWu, Mei-Ling; Lan, Jia-Shen20172017, vol.29, no.2
Solder paste volume effects on assembly yield and reliability for bottom terminated componentsSriperumbudur, Sai Srinivas; Meilunas, Michael; Anselm, Martin20172017, vol.29, no.2



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