期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2017, vol.29, no.1 2017, vol.29, no.2 2017, vol.29, no.3 2017, vol.29, no.4

题名作者出版年年卷期
Corrosion-induced tin whisker growth in electronic devices: a reviewIlles, Balazs; Horvath, Barbara; Geczy, Attila; Krammer, Oliver; Dusek, Karel20172017, vol.29, no.1
Stability of electrical properties for mechanically exposed thick- and thin-film resistors on flexible substratesDziedzic, Andrzej; Osypiuk, Pawel; Steplewski, Wojciech20172017, vol.29, no.1
Studying heat transfer on inclined printed circuit boards during vapour phase solderingGeczy, Attila; Nagy, Daniel; Illes, Balazs; Fazekas, Laszlo; Krammer, Oliver; Busek, David20172017, vol.29, no.1
Structure and thermal behavior of lead-free solders prepared by rapid solidification of their meltDurisin, Martin; Pietrikova, Alena; Durisin, Juraj; Saksl, Karel20172017, vol.29, no.1
Real-time profiling of reflow process in VPS chamberLivovsky, Lubomir; Pietrikova, Alena20172017, vol.29, no.1
The dependence of reliability and mechanical strength of the solder joints in 3D PoP structures from sizes of solder powders applied in soldering materialsSitek, Janusz; Koscielski, Marek; Borecki, Janusz; Serzysko, Tomasz20172017, vol.29, no.1
Optimization of solder paste quantity considering the properties of solder jointsHirman, Martin; Steiner, Frantisek20172017, vol.29, no.1
X-ray inspection and Six-Sigma in analysis of LED thermal pad coverageDziurdzia, Barbara; Mikolajek, Janusz20172017, vol.29, no.1
New method for determining correction factors for pin-in-paste solder volumesKrammer, Oliver; Varga, Bertalan; Dusek, Karel20172017, vol.29, no.1
IMAPS 2016 PolandSkwarek, Agata20172017, vol.29, no.1
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