期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2016, vol.28, no.1 2016, vol.28, no.2 2016, vol.28, no.3 2016, vol.28, no.4

题名作者出版年年卷期
Analytical and finite element methodology modeling of the thermal management of 3D IC with through silicon viaWu, Mei-Ling; Lan, Jia-Shen20162016, vol.28, no.4
Preparation of PEG-rosin derivative for water soluble rosin fluxPhaphon, Kanlaya; Wacharasindhu, Sumrit; Petsom, Amorn20162016, vol.28, no.4
Simulating surface tension of Sn-based lead free solder using an artificial neural networkWu, Min; Su, Xiangyu20162016, vol.28, no.4
IC solder joint inspection based on the Gaussian mixture modelCai, Nian; Ye, Qian; Liu, Gen; Wang, Han; Yang, Zhijing20162016, vol.28, no.4
Effect of P and Ge doping on microstructure of Sn-0.3Ag-0.7Cu/Ni-P solder jointsYan, Xingchen; Xu, Kexin; Wang, Junjie; Wei, Xicheng; Wang, Wurong20162016, vol.28, no.4
Investigation of soldering for crystalline silicon solar cellsYang, Hong; Wang, He; Cao, Dingyue20162016, vol.28, no.4



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