期刊


ISSN0020-2967
刊名Transactions of the Institute of Metal Finishing
参考译名金属精饰学会汇刊
收藏年代1998~2024



全部

1998 1999 2000 2001 2002 2003
2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2014 2015
2016 2017 2018 2019 2020 2021
2022 2023 2024

2015, vol.93, no.1 2015, vol.93, no.2 2015, vol.93, no.3 2015, vol.93, no.4 2015, vol.93, no.5 2015, vol.93, no.6

题名作者出版年年卷期
Electrodeposition of gold-indium alloysDobrovolska, T. S.; Georgiev, M.; Krastev, I.20152015, vol.93, no.6
Influence of a boiling water treatment on the electrochemical properties of a sol-gel film on AA1050Fedel, M.; Deflorian, F.20152015, vol.93, no.6
Development of advanced hybrid materials with the help of pulse electrodepositionMortazavi, N.; Mulone, A.; Melciu, D.; Klement, U.; Maidee, N.20152015, vol.93, no.6
Electrodeposition of Co and CoMo alloys coatings using choline chloride based ionic liquids - evaluation of corrosion behaviourAnicai, L.; Costovici, S.; Cojocaru, A.; Manea, A.; Visan, T.20152015, vol.93, no.6
Effect of additive concentration during copper deposition using EnFACE electrolyteCobley, A.; Roy, S.; Dela Pena, E. M.; Bains, N.; Hussain, A.20152015, vol.93, no.6
New type of micro-bipolar plate for micro-fuel cells using LIGA technology together with improved and cost-effective electroplating processes for PCBsBaumgaertner, M.; Lanzinger, G.; Hahn, L.; Schulz, J.; Helm, P.; Wartmann, J.20152015, vol.93, no.6
EAST - European Academy for Surface TechnologyLeisner, Peter20152015, vol.93, no.6
Tin whisker mitigation by means of a post-electroplating electrochemical oxidation treatmentHaspel, D. M.; Ashworth, M. A.; Wu, L.; Wilcox, G. D.; Mortimer, R. J.20152015, vol.93, no.6
Self-organisation phenomena during electrodeposition of palladium-indium alloysDobrovolska, Ts.; Georgiev, M.; Krastev, I.20152015, vol.93, no.6
Process optimisation of non-cyanide Ag-PTFE metal matrix composite electroplating for threaded connectionsSieh, R.; Le, H. R.; Cree, A. M.20152015, vol.93, no.5
12345678910