期刊


ISSN0960-1317
刊名Journal of Micromechanics and Microengineering
参考译名微型机械与微型工程学报
收藏年代2006～2025



全部

2006 2007 2008 2009 2010 2011
2012 2013 2014 2015 2016 2017
2018 2019 2020 2021 2022 2023
2024 2025

2013, vol.23, no.1 2013, vol.23, no.10 2013, vol.23, no.11 2013, vol.23, no.12 2013, vol.23, no.2 2013, vol.23, no.3
2013, vol.23, no.4 2013, vol.23, no.5 2013, vol.23, no.6 2013, vol.23, no.8 2013, vol.23, no.9

题名作者出版年年卷期
Thermal de-isolation of silicon microstructures in a plasma etching environmentYong-Seok Lee; Yun-Ho Jang; Yong-Kweon Kim; Jung-Mu Kim20132013, vol.23, no.2
A simple analytical method for residual stress measurement on suspended MEM structures using surface profilometryV. Mulloni; S. Colpo; A. Faes; B. Margesin20132013, vol.23, no.2
Curved in-plane electromechanical relay for low power logic applicationsDaniel Grogg; Ute Drechsler; Armin Knoll; Urs Duerig; Yu Pu; Christoph Hagleitner; Michel Despont20132013, vol.23, no.2
Manufacture of glass nanoparticles by electrosprayingKazuhiro Uchida; Atsushi Hotta; Koichi Hishida; Norihisa Miki20132013, vol.23, no.2
A highly sensitive pressure sensor using a Au-patterned polydimethylsiloxane membrane for biosensing applicationsXinchuan Liu; Yihao Zhu; Md W. Nomani; Xuejun Wen; Tain-Yen Hsia; Goutam Koley20132013, vol.23, no.2
Dry adhesive bonding of nanoporous inorganic membranes to microfluidic devices using the OSTE(+) dual-cure polymerFarizah Saharil; Fredrik Forsberg; Yitong Liu; Paolo Bettotti; Neeraj Kumar; Frank Niklaus; Tommy Haraldsson; Wouter van der Wijngaart; Kristinn B. Gylfason20132013, vol.23, no.2
A novel method of hotspot temperature reduction for a 3D stacked CMOS IC chip device fabricated on an ultrathin substrateFumiki Kato; Hiroshi Nakagawa; Masahiro Aoyagi20132013, vol.23, no.2
Surface acoustic wave devices on AlN/3C-SiC/Si multilayer structuresChih-Ming Lin; Yung-Yu Chen; Valery V. Felmetsger; Wei-Cheng Lien; Tommi Riekkinen; Debbie G. Senesky; Albert P. Pisano20132013, vol.23, no.2
Fabrication techniques for multiscale 3D-MEMS with vertical metal micro- and nanowire integrationF. Greiner; S. Quednau; F. Dassinger; R. Sarwar; H. F. Schlaak; M. Guttmann; P. Meyer20132013, vol.23, no.2
Direct fabrication of high-resolution three-dimensional polymeric scaffolds using electrohydrodynamic hot jet plottingChuang Wei; Jingyan Dong20132013, vol.23, no.2
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