期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2025



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2025

2013, vol.135, no.1 2013, vol.135, no.2 2013, vol.135, no.3 2013, vol.135, no.4

题名作者出版年年卷期
High-Efficiency Transient Temperature Calculations for Applications in Dynamic Thermal Management of Electronic DevicesMaxat N. Touzelbaev; Josef Miler; Yizhang Yang; Gamal Refai-Ahmed; Kenneth E. Goodson20132013, vol.135, no.3
3D Compact Model of Packaged Thermoelectric CoolersOwen Sullivan; Borislav Alexandrov; Saibal Mukhopadhyay; Satish Kumar20132013, vol.135, no.3
Geometric Optimization of C-Shaped Cavities According to Bejan's Theory: General Review and Comparative StudyG. Lorenzini; C. Biserni; L. A. O. Rocha20132013, vol.135, no.3
Heat Conduction in Mobile Electronic Equipment: Study on the Effects of Some Key Parameters on Heat Source Temperature Based on a Three-Layer ModelWataru Nakayama20132013, vol.135, no.3
Thermal Performance of an Al_2O_3-Water Nanofluid Pulsating Heat PipeHamid Reza Seyf; Sejung Kim; Yuwen Zhang20132013, vol.135, no.3
Investigation of Dual Electrical Paths for Off-Chip Compliant InterconnectsRaphael Okereke; Karan Kacker; Suresh K. Sitaraman20132013, vol.135, no.3
An Improved Efficient Network Model for Determining the Effective Thermal Conductivity of Particulate Thermal Interface MaterialsB. Dan; B. G. Sammakia; G. Subbarayan; S. Kanuparthi20132013, vol.135, no.3
Advanced Methodologies for Developing Improved Potted Smart Munitions for High-G ApplicationsNien-Hua Chao; John A. Dispenza; Mario DeAngelis20132013, vol.135, no.3
Two-Phase Flow Control of Electronics Cooling With Pseudo-CPUs in Parallel Flow Circuits: Dynamic Modeling and Experimental EvaluationNicolas Lamaison; Jackson Braz Marcinichen; John Richard Thome20132013, vol.135, no.3
Expanded Assessment of a Practical Thermally Aware Energy-Optimized Load Placement Strategy for Open-Aisle, Air-Cooled Data CentersDustin W. Demetriou; H. Ezzat Khalifa20132013, vol.135, no.3
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