期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志;美国机械工程师学会汇刊
收藏年代1995~2024



全部

1995 1996 1997 1998 1999 2000
2001 2002 2003 2004 2005 2006
2007 2008 2009 2010 2011 2012
2013 2014 2015 2016 2017 2018
2019 2020 2021 2022 2023 2024

2013, vol.135, no.1 2013, vol.135, no.2 2013, vol.135, no.3 2013, vol.135, no.4

题名作者出版年年卷期
Investigation on Laser Direct Welding of Quad Flat Pack ComponentsJianwen Yuan; Chao Huang; Jimin Chen; Furong Liu; Yi Qiu20132013, vol.135, no.4
Experimental and Modeling Studies of Looping Process for Wire BondingFuliang Wang; Yun Chen20132013, vol.135, no.4
A Shear Strength Degradation Model for Anisotropic Conductive Adhesive Joints Under Hygrothermal ConditionsBo Tao; Guanghua Wu; Zhouping Yin; Youlun Xiong20132013, vol.135, no.4
Reliability Design of Multirow Quad Flat Nonlead Packages Based on Numerical Design of Experiment MethodGuofeng Xia; Fei Qin; Cha Gao; Tong An; Wenhui Zhu20132013, vol.135, no.4
Solving Thermal Issues in a Three-Dimensional-Stacked-Quad-Core Processor by Microprocessor Floor Planning, Microchannel Cooling, and Insertion of Through-Silicon-ViasAnjali Chauhan; Bahgat Sammakia; Furat F. Afram; Kanad Ghose; Gamal Refai-Ahmed; Dereje Agonafer20132013, vol.135, no.4
Hygromechanical Analysis of Liquid Crystal Display PanelsToru Ikeda; Tomonori Mizutani; Kiyoshi Miyake; Noriyuki Miyazaki20132013, vol.135, no.4
Variable-Length Link-Spring Model for Kink Formation During Wire BondingFuliang Wang; Weidong Tang; Junhui Li; Lei Han20132013, vol.135, no.4
Effects of Voids in Sintered Silver Joint on Thermal and Optoelectronic Performances of High Power Laser DiodeYi Yan; Youliang Guan; Xu Chen; Guo-Quan Lu20132013, vol.135, no.4
A Stepped-Bar Apparatus for Thermal Resistance MeasurementsDakotah R. Thompson; Sameer R. Rao; Baratunde A. Cola20132013, vol.135, no.4
Finite Element Analysis for Shock Resistance Evaluation of Cushion-Packaged Multifunction Printer Considering Internal ModulesSe-Chang Kim; Dae-Geun Cho; Tae-Gyu Kim; Se-Hun Jung; Ja-Choon Koo; Moon-Ki Kim; Jae-Boong Choi20132013, vol.135, no.4
12345