期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2013, vol.25, no.1 2013, vol.25, no.2 2013, vol.25, no.3 2013, vol.25, no.4

题名作者出版年年卷期
Characteristics and properties of Bi-11Ag solderRoman Kolenak; Michal Chachula20132013, vol.25, no.2
Electrodeposition of lead-free solder alloysYingxin Goh; A. S. M. A. Haseeb; Mohd Faizul Mohd Sabri20132013, vol.25, no.2
Effects of reflow on the interfacial characteristics between Zn nanoparticles containing Sn-3.8Ag-0.7Cu solder and copper substrateY. H. Chan; M. M. Arafat; A. S. M. A. Haseeb20132013, vol.25, no.2
Characterization of vapour phase soldering process zone with pressure measurementsAttila Geczy; Balazs Illes; Zsolt Peter; Zsolt Illyefalvi-Vitez20132013, vol.25, no.2
Evolution of curvature under thermal cycling in sandwich assembly bonded by sintered nanosilver pasteYunhui Mei; Gang Chen; Xin Li; Guo-Quan Lu; Xu Chen20132013, vol.25, no.2
Applying CHAID algorithm to investigate critical attributes of void formation in QFN assemblyChien-Yi Huang; Yueh-Hsun Lin20132013, vol.25, no.2



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