期刊


ISSN1059-9495
刊名Journal of Materials Engineering and Performance
参考译名材料工程与特性杂志
收藏年代1998~2024



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2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2014 2015
2016 2017 2018 2019 2020 2021
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2011, vol.20, no.1 2011, vol.20, no.2 2011, vol.20, no.3 2011, vol.20, no.4/5 2011, vol.20, no.6 2011, vol.20, no.7
2011, vol.20, no.8 2011, vol.20, no.9

题名作者出版年年卷期
Preform Design for Large-Sized Frame Forging of Ti-Alloy Based on 3-D Electrostatic Field Simulation and Geometric TransformationJun Cai; Fuguo Li; Taiying Liu20112011, vol.20, no.9
Biaxial Fatigue Life Predicted by Crack Growth Analysis in Various Material Microstructures Modeled by Voronoi-PolygonsToshihiko Hoshide20112011, vol.20, no.9
Slab Analysis of Ring Rolling Assuming Constant Shear FrictionA. Parvizi; K. Abrinia; M. Salimi20112011, vol.20, no.9
A Physically Consistent Path-Weighted Diffusivity Function for Modeling of Drop-by-Drop Liquid Metal DepositionS. G. Lambrakos; K. P. Cooper20112011, vol.20, no.9
Comparative Discrete-Particle Versus Continuum-Based Computational Investigation of Soil Response to Impulse LoadingM. Grujicic; B. Pandurangan; A. Hariharan20112011, vol.20, no.9
THz Dielectric Properties of High Explosives Calculated by Density Functional Theory for the Design of DetectorsA. Shabaev; S. G. Lambrakos; N. Bernstein; V. Jacobs; D. Finkenstadt20112011, vol.20, no.9
Optical Film for LED with Triangular-Pyramidal Array Using Size-Reducible Embossing MethodC. F. Liu; C. T. Pan; K. H. Liu; Y. C. Chen; J. L. Chen; J. C. Huang20112011, vol.20, no.9
Effects of SiC Particle Size and Process Parameters on the Microstructure and Hardness of AZ91/SiC Composite Layer Fabricated by FSPP. Asadi; M. K. Besharati Givi; K. Abrinia; M. Taherishargh; R. Salekrostam20112011, vol.20, no.9
Bonding Mechanisms and Shear Properties of Alumina Ceramic/Stainless Steel Brazed JointG. W. Liu; G. J. Qiao; H. J. Wang; J. P. Wang; T. J. Lu20112011, vol.20, no.9
Tensile Behavior of Ultrafine-Grained Al-4Zn-2Mg Alloy Produced by CryorollingK. Gopala Krishna; Nidhi Singh; K. Venkateswarlu; K. C. Hari Kumar20112011, vol.20, no.9
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