期刊


ISSN1474-0893
刊名Global SMT & Packaging
参考译名全球表面装配技术与包装——欧洲版
收藏年代2004～2024

关联期刊参考译名收藏年代
Test试验 


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2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2016 2017
2018 2019 2020 2021 2022 2023
2024

2010, vol.10, no.10 2010, vol.10, no.11 2010, vol.10, no.12 2010, vol.10, no.2 2010, vol.10, no.3 2010, vol.10, no.4
2010, vol.10, no.5 2010, vol.10, no.6 2010, vol.10, no.7 2010, vol.10, no.8 2010, vol.10, no.9

题名作者出版年年卷期
The electronic interconnection hierarchy: Technological developments are blurring the lines between interconnection levelsJoe Fjelstad20102010, vol.10, no.6
The importance of bond strength measurementBob Sykes20102010, vol.10, no.6
Integrated testing, modeling and failure analysis of CSP~(nl) for board level reliabilityRex Anderson; Tong Yan Tee; Long Bin Tan20102010, vol.10, no.6
Healthy recovery, but keep watching over your shoulder!Walt Custer; Jon Custer-Topai20102010, vol.10, no.6
What is AOI Resolution?Igor Sosman; Adam Shaw20102010, vol.10, no.6
Teaming for improved ruggedized product reliabilityDennis Gradler20102010, vol.10, no.6
Case Study: High quality manufacturing need not mean high production costsTrevor Galbraith20102010, vol.10, no.6
Basic printed board repair and rework for copper tracks and pads, part 2Bob Willis20102010, vol.10, no.6



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