期刊


ISSN1474-0893
刊名Global SMT & Packaging
参考译名全球表面装配技术与包装——欧洲版
收藏年代2004～2024

关联期刊参考译名收藏年代
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2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2016 2017
2018 2019 2020 2021 2022 2023
2024

2010, vol.10, no.10 2010, vol.10, no.11 2010, vol.10, no.12 2010, vol.10, no.2 2010, vol.10, no.3 2010, vol.10, no.4
2010, vol.10, no.5 2010, vol.10, no.6 2010, vol.10, no.7 2010, vol.10, no.8 2010, vol.10, no.9

题名作者出版年年卷期
The not so obvious costs of ESD protection (and ways to mitigate them)Joe Fjelstad20102010, vol.10, no.3
Nanotechnology is now starting to find applications in electronicsAlan Rae20102010, vol.10, no.3
Head-in-pillow: Identifying and highlighting suspect solder jointsEvstatin Krastev; David Bernard20102010, vol.10, no.3
Advances in WLCSP technologies for growing market needsR. Anderson; R. Chilukuri; T. Y. Tee; C. P. Koo; H. S. NG; B. Rogers; A. Syed20102010, vol.10, no.3
On lead compliancy - how it works and how it does not workWerber Engelmaier20102010, vol.10, no.3
Package on package (PoP) defectsBob Willis20102010, vol.10, no.3



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