期刊


ISSN1474-0893
刊名Global SMT & Packaging
参考译名全球表面装配技术与包装——欧洲版
收藏年代2004~2024

关联期刊参考译名收藏年代
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2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2016 2017
2018 2019 2020 2021 2022 2023
2024

2010, vol.10, no.10 2010, vol.10, no.11 2010, vol.10, no.12 2010, vol.10, no.2 2010, vol.10, no.3 2010, vol.10, no.4
2010, vol.10, no.5 2010, vol.10, no.6 2010, vol.10, no.7 2010, vol.10, no.8 2010, vol.10, no.9

题名作者出版年年卷期
Streamlining new product introductionMark Laing20102010, vol.10, no.12
Clean "no-clean," or use a water wash solderGerjan Diepstraten; Tim Lawrence20102010, vol.10, no.12
Estimating the reliability of encapsulated wire bondsWerner Engelmaier20102010, vol.10, no.12
Finding inspiration for the future of the electronics industry in its historyJoe Fjelstad20102010, vol.10, no.12