期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2010, vol.132, no.1 2010, vol.132, no.2 2010, vol.132, no.3 2010, vol.132, no.4

题名作者出版年年卷期
Digital Moire Subtraction Interferometry (DMS) for Electronics Cooling Applications in EnclosuresDavid Newport; Colin Forno; Maurice Whelan20102010, vol.132, no.3
Solid-State Microrefrigeration in Conjunction With Liquid CoolingYounes Ezzahri; Ali Shakouri20102010, vol.132, no.3
Three-Dimensional Measurements of Photo-curing Process With Photo-curable Resin for UV-Nanoimprint by Micro-digital-Holographic-PTVShin-ichi Satake; Gaku Sorimachi; Takahiro Kanai; Jun Taniguchi; Noriyuki Unno20102010, vol.132, no.3
How to Estimate Heat Spreading Effects in PracticeClemens J. M. Lasance20102010, vol.132, no.3
Study on a Pulsating Heat Pipe With Self-Rewetting FluidKoji Fumoto; Masahiro Kawaji; Tsuyoshi Kawanami20102010, vol.132, no.3
Coordinated Optimization of Cooling and IT Power in Data CentersEmad Samadiani; Hrishikesh Amur; Bhavani Krishnan; Yogendra Joshi; Karsten Schwan20102010, vol.132, no.3
CFD-Assisted Optimization of Chimneylike Flows to Cool an Electronic DeviceVarghese Panthalookaran20102010, vol.132, no.3
Interactions Between Flip Chip Underfill and Solder AlloyD. Blass; P. Borgesen20102010, vol.132, no.3
Design of Practical Liquid Metal Cooling Device for Heat Dissipation of High Performance CPUsYueguang Deng; Jing Liu20102010, vol.132, no.3
Phosphor Concentration Effects on Optothermal Characteristics of Phosphor Converted White Light-Emitting DiodesJiun Pyng You; Yeong-Her Lin; Nguyen T. Tran; Frank G. Shi20102010, vol.132, no.3
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