期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志;美国机械工程师学会汇刊
收藏年代1995~2024



全部

1995 1996 1997 1998 1999 2000
2001 2002 2003 2004 2005 2006
2007 2008 2009 2010 2011 2012
2013 2014 2015 2016 2017 2018
2019 2020 2021 2022 2023 2024

2010, vol.132, no.1 2010, vol.132, no.2 2010, vol.132, no.3 2010, vol.132, no.4

题名作者出版年年卷期
Data Center Housing High Performance Supercomputer Cluster: Above Floor Thermal Measurements Compared To CFD AnalysisRoger Schmidt; Madhusudan Iyengar; Joe Caricari20102010, vol.132, no.2
Singularities at Solder Joint Interfaces and Their Effects on Fracture ModelsD. Bhate; D. Chan; G. Subbarayan; L. Nguyen; J. Zhao; D. Edwards20102010, vol.132, no.2
Experimental Analysis Model of an Active Cooling Method for 3D-ICs Utilizing Multidimensional Configured Thermoelectric CoolersHuy N. Phan; Dereje Agonafer20102010, vol.132, no.2
Multi-Objective Optimization to Improve Both Thermal and Device Performance of a Nonuniformly Powered Micro-ArchitectureSaket Karajgikar; Dereje Agonafer; Kanad Ghose; Bahgat Sammakia; Cristina Amon; Gamal Refai-Ahmed20102010, vol.132, no.2
Viscous Scaling Phenomena in Miniature Centrifugal Flow Cooling Fans: Theory, Experiments and CorrelationPatrick A. Walsh; Edmond J. Walsh; Ronan Grimes20102010, vol.132, no.2
Board-Level Solder Joint Reliability Study of Land Grid Array Packages for RF Application Using a Laser Ultrasound Inspection SystemJin Yang; Lizheng Zhang; I. Charles Ume; Camil Ghiu; George White20102010, vol.132, no.2
An Experimental Investigation in the Performance of Water-Filled Silicon Microheat Pipe ArraysD. K. Harris; A. Palkar; G. Wonacott; R. Dean; F. Simionescu20102010, vol.132, no.2
Numerical Modeling of Perforated Tile Flow Distribution in a Raised-Floor Data CenterEmad Samadiani; Jeffrey Rambo; Yogendra Joshi20102010, vol.132, no.2
Evaluation of the Dominant Factor for Electromigration in Sputtered High Purity Al FilmsX. Zhao; M. Saka; M. Yamashita; F. Togoh20102010, vol.132, no.2
Hygro-Thermo-Mechanical Reliability Assessment of a Thermal Interface Material for a Ball Grid Array Package AssemblyXi Liu; Jiantao Zheng; Suresh K. Sitaraman20102010, vol.132, no.2