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期刊

ISSN	1474-0893
刊名	Global SMT & Packaging
参考译名	全球表面装配技术与包装——欧洲版
收藏年代	2004～2025

关联期刊	参考译名	收藏年代
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2004	2005	2006	2007	2008	2009
2010	2011	2012	2013	2016	2017
2018	2019	2020	2021	2022	2023
2024	2025

2009, vol.9, no.1	2009, vol.9, no.10	2009, vol.9, no.11	2009, vol.9, no.12	2009, vol.9, no.2	2009, vol.9, no.3
2009, vol.9, no.4	2009, vol.9, no.5	2009, vol.9, no.6	2009, vol.9, no.7	2009, vol.9, no.8	2009, vol.9, no.9

题名	作者	出版年	年卷期
Practical BGA rework - the simple way forward with POP paste	Trevor Galbraith	2009	2009, vol.9, no.7
Metal-based wafer level packaging	Shari Farrens	2009	2009, vol.9, no.7
Cost reduction of wafer level packaging by using established materials from non-electronics industries	Giles Humpston	2009	2009, vol.9, no.7
Walt Custer and Jon Custer-Topai: Global recovery looking more & more likely	Trevor Galbraith	2009	2009, vol.9, no.7
Solder joint reliability prediction for chip components, MELFs, TSOPs, SOTs, tec.	Trevor Galbraith	2009	2009, vol.9, no.7
Case Study: Reducing recall risk down to no more than three PCB panels	Trevor Galbraith	2009	2009, vol.9, no.7
IC packaging technology retrospective-part 5: The emergence of wafer level packaging	Joe Fjelstad	2009	2009, vol.9, no.7

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