期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



全部

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2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2009, vol.21, no.1 2009, vol.21, no.2 2009, vol.21, no.3 2009, vol.21, no.4

题名作者出版年年卷期
Effects of conformal coating on anisotropically conductive adhesive joints; a medical perspectiveKati Kokko; Hanna Harjunpaa; Anna-Maija Haltia; Pekka Heino; Minna Kellomaki20092009, vol.21, no.4
Measuring the effect of substrate and component finishes on the reliability of isotropic electrically conductive adhesive jointsMartin Wickham; Ling Zou; Christopher Hunt20092009, vol.21, no.4
Improving high-temperature oxidation behaviour of Sn-Zn-Ag-Al-Ga soldersT. K. Yeh; K. L. Lin; B. Salam20092009, vol.21, no.4
On the factors affecting the dissolution of copper in molten lead-free solders and development of a method to assess the soldering parametersD. Di Maio; C. P. Hunt20092009, vol.21, no.4
Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered jointsJianbiao Pan; Tzu-Chien Chou; Jasbir Bath; Dennis Willie; Brian J. Toleno20092009, vol.21, no.4
Reflow profile optimization of μBGA solder joints considering reflow temperature and time couplingTao Bo; Yin Zhouping; Ding Han; Wu Yiping20092009, vol.21, no.4
Local melt process of solder bumping by induction heating reflowHongbo Xu; Mingyu Li; Yonggao Fu; Ling Wang; Jongmyung Kim20092009, vol.21, no.4



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