期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2009, vol.21, no.1 2009, vol.21, no.2 2009, vol.21, no.3 2009, vol.21, no.4

题名作者出版年年卷期
Effect of multiple reflow cycles on ball impact responses of Sn-Ag-Cu solder jointsYi-Shao Lai; C. R. Kao; Hsiao-Chuan Chang; Chin-Li Kao20092009, vol.21, no.3
Edge tail length effect on reliability of DBC substrates under thermal cyclingGuangcheng Dong; Guangyin (Thomas) Lei; Xu Chen; Khai Ngo; Guo-Quan Lu20092009, vol.21, no.3
Effect of substrate material and thickness on reliability of ACA bonded flip chip jointsLaura Frisk; Anne Cumini20092009, vol.21, no.3
Composite coating structure in an implantable electronic deviceKati Kokko; Hanna Harjunpaa; Pekka Heino; Minna Kellomaki20092009, vol.21, no.3
Reliability analysis of a novel fan-out type WLPMing-Chih Yew; Mars Tsai; Dyi-Chung Hu; Wen-Kun Yang; Kuo-Ning Chiang20092009, vol.21, no.3
Six sigma analysis of SMD feeding parameters and board assembly qualityPekka Kytosaho; Timo Liukkonen20092009, vol.21, no.3



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