期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



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2009, vol.21, no.1 2009, vol.21, no.2 2009, vol.21, no.3 2009, vol.21, no.4

题名作者出版年年卷期
Ultrasonic bonding of flexible PCB to rigid PCB using an Sn interlayerKyoo-Seok Kim; Jae-Pil Jung; Y. Norman Zhou20092009, vol.21, no.1
Optimisation modelling for thermal fatigue reliability of lead-free interconnects in fine-pitch flip-chip packagingStoyan Stoyanov; Chris Bailey; Marc Desmulliez20092009, vol.21, no.1
Geometry control of solder interconnects via induction heatingHongbo Xu; Mingyu Li; Yonggao Fu; Ling Wang; Jongmyung Kim20092009, vol.21, no.1
Lead-free solder joint reliability estimation of flip chip package using FEM-based sensitivity analysisChang-Chun Lee; Kuo-Chin Chang; Ya-Wen Yang20092009, vol.21, no.1



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