期刊


ISSN1474-0893
刊名Global SMT & Packaging
参考译名全球表面装配技术与包装——欧洲版
收藏年代2004～2024

关联期刊参考译名收藏年代
Test试验 


全部

2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2016 2017
2018 2019 2020 2021 2022 2023
2024

2008, vol.8, no.1 2008, vol.8, no.10 2008, vol.8, no.11 2008, vol.8, no.12 2008, vol.8, no.2 2008, vol.8, no.3
2008, vol.8, no.4 2008, vol.8, no.5 2008, vol.8, no.6 2008, vol.8, no.7 2008, vol.8, no.8 2008, vol.8, no.9

题名作者出版年年卷期
Challenging times ahead ... Component orders may be exceeding end market demandTrevor Galbraith20082008, vol.8, no.7
Wear-out system reliability with multiple components and load levelsWerner Engelmaier20082008, vol.8, no.7
SMT/Hybrid/Packaging consistently the best show in EuropeTrevor Galbraith20082008, vol.8, no.7
Your Questions Answered at SMT Nuremberg 2008: "Bob Willis Process Advice and Defect Clinic" - Second year at Germanys most loved summer showBob Willis20082008, vol.8, no.7
Solder dross recycling: Tried, tested and proven at Kimball ElectronicsTrevor Galbraith20082008, vol.8, no.7
PCB production & test: tips from pros on lead-free processes, Part 1 - Issues in hot air solder levelling (HASL)Thomas Berger20082008, vol.8, no.7
Understanding hidden reactions and the importance of profile in reflow soldering: Part 1S. Martian Ramkumar; Anand Kannabiran; Aarthi Baskaran; Viswam Puligandla; Bjorn Dahle20082008, vol.8, no.7
Electronic design & engineering firm expands sales by automating PCB assemblyTrevor Galbraith20082008, vol.8, no.7
Micro-Electronics AOI for the Packaging and Semicon industryTrevor Galbraith20082008, vol.8, no.7



国家科技图书文献中心  全球文献资源网  京ICP备05055788号-26  机械工业信息研究院 2018-2024