期刊


ISSN1474-0893
刊名Global SMT & Packaging
参考译名全球表面装配技术与包装——欧洲版
收藏年代2004～2025

关联期刊参考译名收藏年代
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2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2016 2017
2018 2019 2020 2021 2022 2023
2024 2025

2008, vol.8, no.1 2008, vol.8, no.10 2008, vol.8, no.11 2008, vol.8, no.12 2008, vol.8, no.2 2008, vol.8, no.3
2008, vol.8, no.4 2008, vol.8, no.5 2008, vol.8, no.6 2008, vol.8, no.7 2008, vol.8, no.8 2008, vol.8, no.9

题名作者出版年年卷期
New Product Focus: VERSAPRINT screen printer from ERSA - SMT process responsibility and process control at a new levelTrevor Galbraith20082008, vol.8, no.4
Challenges for high density PoP (package on package) utilizing SoP (solder on pad)Joanna Kristine Wildhart; Moody Dreiza20082008, vol.8, no.4
Case Study: Technology partnership for effective RFID system solutions - Muhlbauer, Intune and DELO start a joint research projectFlorian Hierl20082008, vol.8, no.4
Cleaning process integration of cleaning material with cleaning equipmentMike Bixenman; Steve Stack20082008, vol.8, no.4
Static Control - Training is Still the Key to SuccessBob Willis20082008, vol.8, no.4
Seasonal downturn ending ... but global economy remains weakJon Custer-Topai; Walt Custer20082008, vol.8, no.4
Thermal profiling optimizes printed circuit board assemblyEtienne Witte; Paul Austen20082008, vol.8, no.4



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