期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



全部

1995 1996 1997 1998 1999 2000
2001 2002 2003 2004 2005 2006
2007 2008 2009 2010 2011 2012
2013 2014 2015 2016 2017 2018
2019 2020 2021 2022 2023 2024

2008, vol.130, no.1 2008, vol.130, no.2 2008, vol.130, no.3 2008, vol.130, no.4

题名作者出版年年卷期
Reliability of Fine Pitch Sn-3.8Ag-0.7Cu Flip Chip Solder Joints With Different Connection Pads on PCBDezhi Li; Changqing Liu; Paul P. Conway20082008, vol.130, no.1
Boiling of Water at Subatmospheric Conditions With Enhanced Structures: Effect of Liquid Fill VolumeAniruddha Pal; Yogendra Joshi20082008, vol.130, no.1
Wiresweep Reduction via Direct Cavity Injection During Encapsulation of Stacked Chip-Scale PackagesJason M. Brand; Salvatore A. Ruggero; Amip J. Shah20082008, vol.130, no.1
The Effects of Temperature Cyclic Loading on Lead-Free Solder Joints of Wafer Level Chip Scale Package by Taguchi MethodWen-Ren Jong; Hsin-Chun Tsai; Hsiu-Tao Chang; Shu-Hui Peng20082008, vol.130, no.1
Analysis and Prediction of Vibration-Induced Solder Joint Failure for a Ceramic Column Grid Array PackageAndy Perkins; Suresh K. Sitaraman20082008, vol.130, no.1
Development of the Damage State Variable for a Unified Creep Plasticity Damage Constitutive Model of the 95.5Sn-3.9Ag-0.6Cu Lead-Free SolderDavid M. Pierce; Sheri D. Sheppard; Arlo F. Fossum; Paul T. Vianco; Mike K. Neilsen20082008, vol.130, no.1
Investigation of Microporous Coatings and Mesoscale Evaporator Enhancements for Two-Phase Cooling of Electronic ComponentsMark A. Trautman; Murli Tirumala; S. M. You20082008, vol.130, no.1
Enhancement of Cooling Characteristics for Electronic Cooling by Modifying Substrate Under Natural ConvectionYung-Shin Tseng; Tzu-Ghen Hung; Bau-Shei Pei20082008, vol.130, no.1
Damage Initiation and Propagation in Voided Joints: Modeling and ExperimentLeila Jannesari Ladani; Abhijif Dasgupta20082008, vol.130, no.1
Numerical and Experimental Analysis of Solder Joint Self-Alignment in Fiber Attachment SolderingWei Zhang20082008, vol.130, no.1
12



国家科技图书文献中心  全球文献资源网  京ICP备05055788号-26  机械工业信息研究院 2018-2024