期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2008, vol.20, no.1 2008, vol.20, no.2 2008, vol.20, no.3 2008, vol.20, no.4

题名作者出版年年卷期
An investigation into the rheological properties of different lead-free solder pastes for surface mount applicationsS. Mallik; N. N. Ekere; R. Durairaj; A. E. Marks20082008, vol.20, no.2
Design, materials, and assembly process of high-density packages with a low-temperature lead-free solder (SnBiAg)John Lau; Jerry Gleason; Valeska Schroeder; Gregory Henshall; Walter Dauksher; Bob Sullivan20082008, vol.20, no.2
Reliability test and failure analysis of high-density packages assembled with a low-temperature lead-free solder (SnBiAg)John Lau; Jerry Gleason; Valeska Schroeder; Gregory Henshall; Walter Dauksher; Bob Sullivan20082008, vol.20, no.2
Reliability study of surface mount printed circuit board assemblies with lead-free solder jointsJeffery C. C. Lo; B. F. Jia; Z. Liu; J. Zhu; S. W. Ricky Lee20082008, vol.20, no.2



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