期刊


ISSN1474-0893
刊名Global SMT & Packaging
参考译名全球表面装配技术与包装——欧洲版
收藏年代2004～2024

关联期刊参考译名收藏年代
Test试验 


全部

2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2016 2017
2018 2019 2020 2021 2022 2023
2024

2007, vol.7, no.1 2007, vol.7, no.10 2007, vol.7, no.11 2007, vol.7, no.12 2007, vol.7, no.2 2007, vol.7, no.3
2007, vol.7, no.4 2007, vol.7, no.5 2007, vol.7, no.6 2007, vol.7, no.7 2007, vol.7, no.8 2007, vol.7, no.9

题名作者出版年年卷期
Case Study - Kyzen Corporation A scientific approach to cleaningTrevor Galbraith20072007, vol.7, no.12
Some reflections on lead free solder issues - Dr Wallace RubinWallace Rubin20072007, vol.7, no.12
Optimizing thermal and mechanical performance in PCBsAlex Mangroli; Kris Vasoya20072007, vol.7, no.12
Printing using micro stencils for LGA/QFN reworkBob Willis20072007, vol.7, no.12
Fundamentals of solder paste technologyDosten Baluch; Gerard Minogue20072007, vol.7, no.12



国家科技图书文献中心  全球文献资源网  京ICP备05055788号-26  机械工业信息研究院 2018-2024