期刊


ISSN1474-0893
刊名Global SMT & Packaging
参考译名全球表面装配技术与包装——欧洲版
收藏年代2004～2024

关联期刊参考译名收藏年代
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2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2016 2017
2018 2019 2020 2021 2022 2023
2024

2007, vol.7, no.1 2007, vol.7, no.10 2007, vol.7, no.11 2007, vol.7, no.12 2007, vol.7, no.2 2007, vol.7, no.3
2007, vol.7, no.4 2007, vol.7, no.5 2007, vol.7, no.6 2007, vol.7, no.7 2007, vol.7, no.8 2007, vol.7, no.9

题名作者出版年年卷期
Ten lessons learned in cleaning Pb-free flux residuesMike Bixenman; Erik Miller; Fernando Rueda20072007, vol.7, no.1
Characterizing mechanical stress: caused by packaging processesSoeren Hirsch; Soeren Majcherek; Bertram Schmidt20072007, vol.7, no.1
Low-warpage molding compound development for array packagesIrving Y. Chien; Jack Zhang; Lou Rector; Michael Todd20072007, vol.7, no.1
Does lean manufacturing really save money?Todd Baggett20072007, vol.7, no.1
XRF - A reality checkSia Afshari; W. J. Hall20072007, vol.7, no.1
How to specify reliable PCBs for lead-free solder assembly, part 2Trevor Galbraith20072007, vol.7, no.1
Permalex squeegee products improve the SMT printing processTrevor Galbraith20072007, vol.7, no.1



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